Pierre-Yves Guittet

High speed full wafer monitoring of surface, edge and bonding interface for 3Dstacking

Anne Jourdain, Sandip Halder, Andy Miller, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Improved control of multi-layer overlay in advanced 8nm logic nodes

Mohamed El Kodadi, Tae-Sun Kim, Sung-Won Choi, 2018, Advanced Lithography.

Full wafer macro-CD imaging for excursion control of fast patterning processes

Christoph Kappel, Pierre-Yves Guittet, Lars Markwort, 2010, Advanced Lithography.

Metrology and inspection for process control during bonding and thinning of stacked wafers for manufacturing 3D SIC's

Eric Beyne, Anne Jourdain, Sandip Halder, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).