Loh Wei Keat

Dynamic characterization study of flip chip ball grid array (FCBGA) on peripheral component interconnect (PCI) board application

Wong Shaw Fong, Loh Wei Keat, Lee Yung Hsiang, 2005, 2005 International Symposium on Electronics Materials and Packaging.

Nonlinear dynamic behavior of thin PCB board for solder joint reliability study under shock loading

Loh Wei Keat, Lee Yung Hsiang, Ajay Munigayah, 2005, 2005 International Symposium on Electronics Materials and Packaging.