M. Y. Lau
发表
B. J. Han,
S. Das,
Robert C. Frye,
1995,
Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).
Robert C. Frye,
M. Y. Lau,
King Lien Tai,
1993,
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93.
Robert C. Frye,
M. Y. Lau,
King Lien Tai,
1994,
Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).
Bruce A. Wooley,
M. Y. Lau,
D. C. Soo,
1985,
1985 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.
A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate
R. C. Frye,
M. Y. Lau,
King Lien Tai,
1994,
Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).
Robert G. Swartz,
M. Y. Lau,
V. D. Archer,
1991
.
D. Kossives,
Yicheng Lu,
R. C. Frye,
1999
.
Robert C. Frye,
M. Y. Lau,
King Lien Tai,
1992,
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92.
D. Kossives,
Yicheng Lu,
R. C. Frye,
1995,
Proceedings of Electrical Performance of Electronic Packaging.
M. Y. Lau,
V. D. Archer,
G. M. Chin,
1988,
Technical Digest., International Electron Devices Meeting.