N. Panousis

The Effects of Gold and Nickel Plating Thicknesses on the Strength and Reliability of Thermocompress

P. M. Hall, N. Panousis, 1976 .

Reduced Gold-Plating on Copper Leads for Thermocompression Bonding-Part I: Initial Characterization

N. Panousis, N. Panousis, P. Hall, 1977 .

Thermocompression Bondability of Thick-film Gold-A Comparison to Thin-Film Gold

N. Panousis, R. Kershner, 1980 .

Diamond-Tipped and Other New Thermodes for Device Bonding

N. Panousis, R. Kershner, 1979 .

Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated Aging

N. Panousis, P. M. Hall, N. Panousis, 1975 .

Reduced Gold-Plating on Copper Leads for Thermocompression Bonding--Part II: Long Term Reliability

N. Panousis, P. Hall, 1977 .