P. Ramm

Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A.

Fred Roozeboom, Mitsumasa Koyanagi, Philip Garrou, 2009 .

Processing, Materials, and Integration of Damascene and 3D Interconnects : Preface

Fred Roozeboom, O. M. Leonte, P. Ramm, 2010 .

MAGIC: a European program to push the insertion of maskless lithography

S. Manakli, L. Pain, W. Pilz, 2008, SPIE Advanced Lithography.

3D System Integration

P. Ramm, A. Klumpp, R. Merkel, 2007, 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).

Technologies for 3D wafer level heterogeneous integration

H. Reichl, P. Ramm, A. Klumpp, 2008, 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.

Recent trends in receptor analysis techniques and instrumentation

P. Ramm, P. Ramm, J. Palacios, 1991, Journal of Chemical Neuroanatomy.

Through silicon via technology — processes and reliability for wafer-level 3D system integration

H. Reichl, P. Ramm, B. Wunderle, 2008, 2008 58th Electronic Components and Technology Conference.

Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC

P. Ramm, B. Wunderle, E. Auerswald, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).