Treliant Fang

发表

Environmentally Sound Assembly Processes

Treliant Fang, 1999 .

Physical design and assembly process development of a multi-chip package containing a light emitting diode (LED) array die

Treliant Fang, G. Tam, K. Kaskoun, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Anisotropic conductive adhesive films for flip chip on flex packages

Treliant Fang, Li Li, T. Fang, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Polycyanate esters: Science and applications

Treliant Fang, T. Fang, David A. Shimp, 1995 .