Mauro Ciappa

发表

Overstress and electrostatic discharge in CMOS and BCD integrated circuits

Gaudenzio Meneghesso, Giuseppe Croce, Mauro Ciappa, 2000 .

Gaudenzio Meneghesso, Francesco Iannuzzo, Mauro Ciappa, 2018, Microelectron. Reliab..

Thermal component model for electrothermal analysis of IGBT module systems

Wolfgang Fichtner, Mauro Ciappa, P. Malberti, 2001 .

Ensuring the reliability of electron beam crosslinked electric cables by the optimization of the dose depth distribution with Monte Carlo simulation

Wolfgang Fichtner, Stephan Ott, Mauro Ciappa, 2009, Microelectron. Reliab..

Exploring the limits of scanning electron microscopy for the metrology of critical dimensions of photoresist structures in the nanometer range

Mauro Ciappa, Emre Ilgünsatiroglu, Alexey Yu. Illarionov, 2014, Microelectron. Reliab..

Measurement of the transient junction temperature in MOSFET devices under operating conditions

Wolfgang Fichtner, Michel Mermet-Guyennet, Mauro Ciappa, 2007, Microelectron. Reliab..

Lifetime prediction of IGBT modules for traction applications

Wolfgang Fichtner, Mauro Ciappa, M. Ciappa, 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

Monte Carlo simulation of emission site, angular and energy distributions of secondary electrons in silicon at low beam energies

Mauro Ciappa, Emre Ilgünsatiroglu, Alexey Yu. Illarionov, 2012, Microelectron. Reliab..

Experimental characterization of critical high-electric field spots in power semiconductors by planar and scanning collimated alpha sources

Chenchen Sun, Mauro Ciappa, Ying Pang, 2018, Microelectron. Reliab..

A study of the threshold-voltage suitability as an application-related reliability indicator for planar-gate non-punch-through IGBTs

Wolfgang Fichtner, Alberto Castellazzi, Michel Mermet-Guyennet, 2007, Microelectron. Reliab..

Exact 3D simulation of Scanning Electron Microscopy images of semiconductor devices in the presence of electric and magnetic fields

Mauro Ciappa, Emre Ilgünsatiroglu, Alexey Yu. Illarionov, 2014, Microelectron. Reliab..

Electro-thermal simulation in the time domain of GaN HEMT for RF switch-mode amplifier

Wolfgang Fichtner, Satoshi Ono, Mauro Ciappa, 2012, Microelectron. Reliab..

On the Use of Neural Networks to Solve the Reverse Modelling Problem for the Quantification of Dopant Profiles Extracted by Scanning Probe Microscopy Techniques

Elisa Ricci, Andrea Scorzoni, Wolfgang Fichtner, 2004, Microelectron. Reliab..

Novel built-in methodology for defect testing of capacitor oxide in SAR analog to digital converters for critical automotive applications

Wolfgang Fichtner, Mauro Ciappa, V. Malandruccolo, 2010, 2010 15th IEEE European Test Symposium.

Electro-thermal simulation of current sharing in silicon and silicon carbide power modules under short circuit condition of types I and II

Hiroshi Suzuki, Mauro Ciappa, 2016, Microelectron. Reliab..

Modeling the threshold voltage instability in SiC MOSFETs by multiphonon-assisted tunneling

Mauro Ciappa, Takuo Kikuchi, 2016, Microelectron. Reliab..

Assessment of the Analytical Capabilities of Scanning Capacitance and Scanning Spreading Resistance Microscopy Applied to Semiconductor Devices

Wolfgang Fichtner, Mauro Ciappa, Maria Stangoni, 2005, Microelectron. Reliab..

Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices

Wolfgang Fichtner, Mauro Ciappa, Haruka Kubo, 2009, Microelectron. Reliab..

Lifetime modeling of thermomechanics-related failure mechanisms in high power IGBT modules for traction applications

Wolfgang Fichtner, Mauro Ciappa, F. Carbognani, 2003, ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings..

Design of optimum electron beam irradiation processes for the reliability of electric cables used in critical applications

Wolfgang Fichtner, Stephan Ott, Mauro Ciappa, 2011, Microelectron. Reliab..

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Franc Dugal, Mauro Ciappa, M. Ciappa, 2014, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Measurement of the Pre-Breakdown Characteristics in Silicon Carbide Power Devices by the Use of Radioactive Gamma Sources

Mauro Ciappa, Marco Pocaterra, M. Ciappa, 2020, 2020 IEEE International Reliability Physics Symposium (IRPS).

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach

Alberto Castellazzi, Michel Mermet-Guyennet, Mauro Ciappa, 2007, Microelectron. Reliab..

Multi-domain multi-level abstraction modelling of integrated power devices

Alberto Castellazzi, Mauro Ciappa, 2009 .

Hydrogen Passivation of Boron Acceptors and Long-Term Breakdown Voltage Instability in N/sup +//P Su

Mauro Ciappa, P. Malberti, A. Birolini, 1996, Proceedings of International Reliability Physics Symposium.

New on-chip screening of gate oxides smart power devices for automotive applications

Wolfgang Fichtner, Mauro Ciappa, Hubert Rothleitner, 2009, 2009 IEEE International Reliability Physics Symposium.

Two-dimensional Dopant Profiling and Imaging of 4H Silicon Carbide Devices by Secondary Electron Potential Contrast

Wolfgang Fichtner, Mauro Ciappa, Maria Stangoni, 2005, Microelectron. Reliab..

Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules

Franc Dugal, Mauro Ciappa, M. Ciappa, 2013, Microelectron. Reliab..

TCAD simulation of current filamentation in adjacent IGBT cells under turn-on and turn-off short circuit condition

Hiroshi Suzuki, Mauro Ciappa, 2015, Microelectron. Reliab..

Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications

Wolfgang Fichtner, Alberto Castellazzi, Michel Mermet-Guyennet, 2006, Microelectron. Reliab..

Comprehensive Electro-Thermal Compact Model of a 3.3kV-1200A IGBT-module

Wolfgang Fichtner, Guillaume Lourdel, Alberto Castellazzi, 2007, 2007 International Conference on Power Engineering, Energy and Electrical Drives.

New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions

Wolfgang Fichtner, Alberto Castellazzi, Michel Mermet-Guyennet, 2006, Microelectron. Reliab..

Charge and energy deposition in thick silicon depletion layers by environmental ionizing radiation and terrestrial cosmic rays

Mauro Ciappa, Ying Pang, M. Ciappa, 2018, Microelectron. Reliab..

A new built-in screening methodology for Successive Approximation Register Analog to Digital Converters

Wolfgang Fichtner, Mauro Ciappa, M. Hommel, 2010, Microelectron. Reliab..

Lifetime Modeling and Prediction of Power Devices (Invited Paper)

Mauro Ciappa, 2008 .

A new built-in screening methodology to achieve zero defects in the automotive environment

Wolfgang Fichtner, Mauro Ciappa, Hubert Rothleitner, 2009, Microelectron. Reliab..

On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices

Wolfgang Fichtner, Massimo Vanzi, Giovanna Mura, 2003, Microelectron. Reliab..

Characterization of self-heating effects in semiconductor resistors during transmission line pulses

Wolfgang Fichtner, Gaudenzio Meneghesso, Chiara Corvasce, 2004, Microelectron. Reliab..

Reliability odometer for real-time and in situ lifetime measurement of power devices

Mauro Ciappa, Alessandro Blascovich, M. Ciappa, 2015, Microelectron. Reliab..

Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles

Wolfgang Fichtner, Mauro Ciappa, Y. Yamada, 2005, Microelectron. Reliab..

Design and Experimental Characterization of a New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Wolfgang Fichtner, Mauro Ciappa, V. Malandruccolo, 2011 .

A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy

Wolfgang Fichtner, Mauro Ciappa, Maria Stangoni, 2003, Microelectron. Reliab..

Lifetime prediction and design of reliability tests for high-power devices in automotive applications

Wolfgang Fichtner, Mauro Ciappa, Paolo Cova, 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

Failure Mechanisms of Power Devices

Mauro Ciappa, 2017 .

Robustness test and failure analysis of IGBT modules during turn-off

Alberto Castellazzi, Michel Mermet-Guyennet, Mauro Ciappa, 2007, Microelectron. Reliab..

Lifetime Modeling and Prediction of Power Devices

Mauro Ciappa, 2008 .

Lifetime extrapolation for IGBT modules under realistic operation conditions

Wolfgang Fichtner, Fausto Fantini, Mauro Ciappa, 1999 .

Semiconductor Devices & Processes: TCAD Modeling and Simulation

Mauro Ciappa, 2017 .

Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules

Mauro Ciappa, P. Malberti, M. Ciappa, 1996 .

A novel Monte Carlo simulation code for linewidth measurement in critical dimension scanning electron microscopy

Wolfgang Fichtner, Stephan Holzer, Mauro Ciappa, 2010, Scanning Microscopies.

A new two-dimensional TCAD model for threshold instability in silicon carbide MOSFETs

Mauro Ciappa, Takuo Kikuchi, M. Ciappa, 2013, Microelectron. Reliab..

Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules

Franc Dugal, Mauro Ciappa, M. Ciappa, 2017, Microelectron. Reliab..

Editorial

Gaudenzio Meneghesso, Francesco Iannuzzo, Mauro Ciappa, 2012, Microelectron. Reliab..

A novel built-in methodology for screening LDMOS transistors to achieve zero defects in the automotive environment

Wolfgang Fichtner, Mauro Ciappa, Hubert Rothleitner, 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

Analysis of conducted and radiated noise propagation using comprehensive electromagnetic model of power MHz-switching circuit

Mauro Ciappa, Keiju Yamada, Shigeru Hiura, 2013, 2013 International Symposium on Electromagnetic Compatibility.

Synthesis of scanning electron microscopy images by high performance computing for the metrology of advanced CMOS processes

Wolfgang Fichtner, Mauro Ciappa, Aniello Esposito, 2011, Microelectron. Reliab..

SCR operation mode of diode strings for ESD protection

Wolfgang Fichtner, Christian Russ, Kai Esmark, 2005, 2005 Electrical Overstress/Electrostatic Discharge Symposium.

Characterization of photonic devices by secondary electron potential contrast

Wolfgang Fichtner, Mauro Ciappa, Marco Buzzo, 2006, Microelectron. Reliab..

Thermal characterization of IGBT power modules

Fausto Fantini, Mauro Ciappa, P. Malberti, 1997 .

Lifetime prediction on the base of mission profiles

Mauro Ciappa, 2005, Microelectron. Reliab..

Novel simulation approach for transient analysis and reliable thermal management of power devices

Alberto Castellazzi, Mauro Ciappa, M. Ciappa, 2008, Microelectron. Reliab..

Lifetime prediction and design of reliability tests for high-power devices in automotive applications

Wolfgang Fichtner, Mauro Ciappa, F. Carbognani, 2003 .

2D Dopant Profiling on 4H Silicon Carbide P+N Junction by Scanning Capacitance and Scanning Electron Microscopy

Wolfgang Fichtner, Mauro Ciappa, Maria Stangoni, 2004, Microelectron. Reliab..

A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors

Wolfgang Fichtner, Flavio Carbognani, Mauro Ciappa, 2002, Microelectron. Reliab..

A New Built-In Defect-Based Testing Technique to Achieve Zero Defects in the Automotive Environment

Wolfgang Fichtner, Mauro Ciappa, Hubert Rothleitner, 2011, IEEE Transactions on Device and Materials Reliability.

Modeling secondary electron images for linewidth measurement by critical dimension scanning electron microscopy

Wolfgang Fichtner, Mauro Ciappa, Alexander Koschik, 2010, Microelectron. Reliab..

Reliability issues in power electronics

Francesco Iannuzzo, Mauro Ciappa, M. Ciappa, 2016, Microelectron. Reliab..

VHDL-AMS simulation of integrated power systems: a unified solution for multi-domain multi-level abstraction analysis

Wolfgang Fichtner, Alberto Castellazzi, Michel Mermet-Guyennet, 2008 .

New integrated Monte Carlo code for the simulation of high-resolution scanning electron microscopy images for metrology in microlithography

Mauro Ciappa, Lars Bomholt, Alexey Yu. Illarionov, 2014, Advanced Lithography.

Diamond-Coated Cantilevers for Scanning Capacitance Microscopy Applications

Wolfgang Fichtner, Mauro Ciappa, H. Yabuhara, 2001, Microelectron. Reliab..

Monte Carlo modeling of the extraction of roughness parameters at nanometer scale by Critical Dimension Scanning Electron Microscopy

Mauro Ciappa, Emre Ilgünsatiroglu, Alexey Yu. Illarionov, 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).

Computer assisted thermal design of an integrated starter generator and model assessment under realistic operating conditions

Wolfgang Fichtner, Norbert Seliger, Mauro Ciappa, 2003 .

Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction

Wolfgang Fichtner, Mauro Ciappa, Maria Stangoni, 2002, Microelectron. Reliab..

Accurate extraction of the mechanical properties of thin films by nanoindentation for the design of reliable MEMS

Wolfgang Fichtner, Mauro Ciappa, Yuji Sasaki, 2010, Microelectron. Reliab..

Selected failure mechanisms of modern power modules

Mauro Ciappa, M. Ciappa, 2002, Microelectron. Reliab..

Unstructured tetrahedric meshes for the description of complex three-dimensional sample geometries in Monte Carlo simulation of scanning electron microscopy images for metrology applications

Mauro Ciappa, Emre Ilgünsatiroglu, Alexey Yu. Illarionov, 2013, Microelectron. Reliab..

Assessing the pre-breakdown carriers' multiplication in SiC power MOSFETs by soft gamma radiation and its correlation to the Terrestrial Cosmic Rays failure rate data as measured by neutron irradiation

Mauro Ciappa, Marco Pocaterra, M. Ciappa, 2021, 2021 IEEE International Reliability Physics Symposium (IRPS).

Quantification of scanning capacitance microscopy measurements for 2D dopant profiling

Wolfgang Fichtner, Mauro Ciappa, P. Malberti, 2000 .

Simulation of scanning capacitance microscopy measurements on micro-sectioned and bevelled n+–p samples

Wolfgang Fichtner, Mauro Ciappa, L. Ciampolini, 2001 .

Modelling thermal effects of large contiguous voids in solder joints

Wolfgang Fichtner, Mauro Ciappa, P. Malberti, 1999 .

Assessing the performance of two-dimensional dopant profiling techniques

Yossi Rosenwaks, Wolfgang Fichtner, Trudo Clarysse, 2004 .

Monte Carlo modeling in the low-energy domain of the secondary electron emission of polymethylmethacrylate for critical-dimension scanning electron microscopy

Wolfgang Fichtner, Mauro Ciappa, Maurizio Dapor, 2010 .

Fine tuning of electron beam crosslinking of electrical cables and wires by three-dimensional Monte Carlo modeling

Wolfgang Fichtner, Stephan Ott, Mauro Ciappa, 2010, 2010 IEEE International Symposium on Electrical Insulation.

Modeling the threshold voltage instability in SiC MOSFETs at high operating temperature

Mauro Ciappa, Takuo Kikuchi, M. Ciappa, 2014, 2014 IEEE International Reliability Physics Symposium.

Reliability of laser diode modules in temperature-uncontrolled environment

Mauro Ciappa, P. Malberti, 1994, Proceedings of 1994 IEEE International Reliability Physics Symposium.