S. Canumalla

Package to board interconnection shear strength (PBISS): effect of surface finish, PWB build-up layer and chip scale package structure

Hee-Dong Yang, Puligandla Viswanadham, S. Canumalla, 2004 .

Effect of intermetallic phases on performance in a mechanical drop environment: 96.5Sn3.5Ag solder on Cu and Ni/Au pad finishes

S. Mathew, S.K. Saha, S. Canumalla, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: transducer selection

S. Canumalla, S. Canumalla, 1999 .

Enhancing drop test efficacy for product quality improvement through interconnection shear tests

A. Kujala, S. Canumalla, M. Hanabe, 2006, 56th Electronic Components and Technology Conference 2006.

Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop

S. Canumalla, M. Hanabe, S. Canumalla, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Intermetallic morphology and damage evolution under thermomechanical fatigue of lead (Pb)-free solder interconnections

S. Canumalla, S. Dunford, S. Canumalla, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Critical issues in thin layer acoustic image interpretation and metrology for microelectronics

S. Canumalla, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Thin layer acoustic image interpretation and metrology for microelectronics using a broadband model

S. Canumalla, 2005, IEEE Transactions on Components and Packaging Technologies.