Paul D. Franzon

发表

Accurate experimental characterization of three-ports

S. B. Goldberg, Michael B. Steer, Paul D. Franzon, 1991, 1991 IEEE MTT-S International Microwave Symposium Digest.

Communication using a Low-Swing Pulse Receiver

Jian Xu, Paul D. Franzon, Liang Zhang, 2005 .

Parasitic Extraction Accuracy - How Much is Enough?

Paul D. Franzon, Mark Basel, Aki Fujimara, 1999, DAC 1999.

Evaluation of dynamically programmable cache machine with low power field programmable gate arrays (fpgas) and 3-dimensional multi-chip-module package

Paul D. Franzon, Mouna Nakkar, 1999 .

Introducing the through-line deembedding procedure

S. B. Goldberg, Michael B. Steer, Paul D. Franzon, 1992, 1992 IEEE Microwave Symposium Digest MTT-S.

Panel: parasitic extraction accuracy; how much is enough?

Paul D. Franzon, M. S. Basel, 1999, DAC 1999.

Experimental electrical characterization of high speed interconnects

S. B. Goldberg, Michael B. Steer, Paul D. Franzon, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling

Jian Xu, Paul D. Franzon, Liang Zhang, 2009, IEEE Trans. Very Large Scale Integr. Syst..

Through-Wafer Optical Interconnects For Multi-Wafer Wafer-Scale Integrated Architectures

Paul D. Franzon, L. A. Hornak, Mehdi Hatamian, 1986, Optics & Photonics.

Method for automated waveform analysis of transient responses in digital circuits

Michael B. Steer, Paul D. Franzon, S. Simovich, 1993 .

Use of AC Coupled Interconnect in Contactless Packaging

Paul D. Franzon, 2010 .

4 Gbps high-density AC coupled interconnection

Paul D. Franzon, John Wilson, S. Mick, 2002, Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285).

Three dimensional high density MCM package assembly and analysis

Paul D. Franzon, A. Glaser, Glenn A. Rinne, 1999 .

Trusted Fabrication through 3D Integration

Paul D. Franzon, Steve Lipa, Lisa McIlrath, 2017 .

Corrections to "Crosstalk-Canceling Multimode Interconnect Using Transmitter Encoding"

Paul D. Franzon, HoonSeok Kim, Chanyoun Won, 2017, IEEE Trans. Very Large Scale Integr. Syst..

Molectronics: a circuit design perspective

Paul D. Franzon, David P. Nackashi, 2001, SPIE Micro + Nano Materials, Devices, and Applications.

Comparison of modeling techniques in circuit variability analysis

Paul D. Franzon, M. B. Yelten, Michael B. Steer, 2012 .

Hierarchical simulation of high speed digital interconnects using a packaging simulator

Michael B. Steer, Paul D. Franzon, Mark Basel, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

International Roadmap of Devices and Systems 2017 Edition: Beyond CMOS chapter.

Paul D. Franzon, Paul D. Franzon, Geoffrey W. Burr, 2018 .

High-Frequency Characterization ofPrinted CPW Lines onTextiles using aCustomTestFixture

Paul D. Franzon, Edward Grant, H. T. Nagle, 2006 .

Programmable MEMS capacitor arrays

Paul D. Franzon, John Wilson, Bruce E. Duewer, 1999, Smart Materials, Nano-, and Micro- Smart Systems.

Performance Evaluation of Micromechanical Binary Phase-only

Paul D. Franzon, Bruce E. Duewer, David A. Winick, 1997 .

Simulation of high speed interconnects using a convolution-based hierarchical packaging simulator

Michael B. Steer, Paul D. Franzon, Mark Basel, 1995 .

An integrated self-masking technique for providing low-loss metallized RF MEMS devices in a polysilicon only MEMS process (Invited Paper)

Paul D. Franzon, Rizwan Bashirullah, John Wilson, 2005, SPIE Microtechnologies.

Improving interconnect characteristics of thin film MEMS processes

Paul D. Franzon, John F. Muth, Bruce E. Duewer, 2001, SPIE Micro + Nano Materials, Devices, and Applications.

A Review of 3-D Packaging Technology

Said F. Al-Sarawi, Derek Abbott, Paul D. Franzon, 1998 .

Crosstalk driven routing advice

Michael B. Steer, Paul D. Franzon, M. Sengupta, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver

Paul D. Franzon, Jian Xu, Lei Luo, 2006, IEEE Journal of Solid-State Circuits.

Experimental electrical characterization of interconnects and discontinuities in high-speed digital systems

S. B. Goldberg, Michael B. Steer, Paul D. Franzon, 1991 .

Design of rotating MEMS tunable capacitors for use at rf and microwave frequencies

Paul D. Franzon, Rizwan Bashirullah, John Wilson, 2001, SPIE Micro + Nano Materials, Devices, and Applications.

Design of a Rectifier-Free Near-Threshold UHF Gen2 RFID Tag using Dual-Phase RF-only Logic

Paul D. Franzon, Wenxu Zhao, Kirti Bhanushali, 2018, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Improved delay prediction for on-chip buses [high-level synthesis]

Paul D. Franzon, Griff L. Bilbro, R. G. Pomerleau, 1999, Proceedings 1999 Design Automation Conference (Cat. No. 99CH36361).

Fully integrated AC coupled interconnect using buried bumps

Paul D. Franzon, Alan Huffman, John Wilson, 2005 .

Comments on "An accurate measurement technique for line properties, junction effects, and dielectric and magnetic parameters" [with reply]

S. B. Goldberg, Michael B. Steer, Paul D. Franzon, 1992 .

AC Coupled Interconnect for Low Power Spaceborne Electronics

Paul D. Franzon, Steve Lipa, 2006 .

Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

Paul D. Franzon, W. Rhett Davis, W. Shepherd Pitts, 2019, 2019 International 3D Systems Integration Conference (3DIC).

Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia

Paul D. Franzon, Characterization Design, Packaging for Mems, 2001 .

MEMS-based diffractive optical-beam-steering technology

Paul D. Franzon, Umut Eksi, John M. Wilson, 1998, Photonics West.

A low power PSK receiver for space applications in 0.35-/spl mu/m SOI CMOS

Mehmet Rasit Yuce, Paul D. Franzon, Wentai Liu, 2003, Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003..