H.J.L. Bressers

Virtual thermo-mechanical prototyping of electronic packaging challenges in material characterization and modeling

A.A.O. Tay, Leo J. Ernst, J. Janssen, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

D.G. Yang, G.Q. Zhang, H.J.L. Bressers, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Warpage minimization of the HVQFN map mould

W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Development of a new low-stress hyperred LED encapsulant

H.J.L. Bressers, R.J.M. Zwiers, B. Ouwehand, 1989 .

Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound

K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

K.M.B. Jansen, G.Q. Zhang, Xuejun Fan, 2004, IEEE Transactions on Components and Packaging Technologies.

Modeling of cure-induced warpage of plastic IC packages

W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

A novel tool for cure dependent viscoelastic characterization of packaging polymers

K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

J.F.J.M. Caers, M. S. Kiasat, Leo J. Ernst, 2002 .

Viscoelastic characterization of fast curing moulding compounds

K.M.B. Jansen, J.H.J. Janssen, H.J.L. Bressers, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Parameter sensitivity study of cure-dependent underfill properties on flip chip failures

D.G. Yang, G.Q. Zhang, W. van Driel, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Cure, temperature and time dependent constitutive modeling of moulding compounds

K.M.B. Jansen, G.Q. Zhang, H.J.L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Determination of visco-elastic properties during the curing process of underfill materials

D.G. Yang, G.Q. Zhang, H.J.L. Bressers, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Constitutive modeling of moulding compounds [electronic packaging applications]

K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).