D. Vanderstraeten

Effect of Residual TiN on Reliability of Au Wire Bonds during High Temperature Storage

D. Iyer, J. M. McGlone, G. Brizar, 2020, 2020 IEEE International Reliability Physics Symposium (IRPS).

Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects

D. Vanderstraeten, T. Moore, D. Vanderstraeten, 2002 .

Determination of BGA structural defects and solder joint defects by 3D X-ray laminography

D. Vanderstraeten, T. D. Moore, P. M. Forssell, 2001, Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).