Kurt E. Wampler

发表

Design of 200-nm, 170-nm, and 140-nm DUV contact sweeper high-transmission attenuating phase-shift mask through simulation I

Robert John Socha, John S. Petersen, J. Fung Chen, 1998, Photomask Technology.

Contact hole reticle optimization by using interference mapping lithography (IML)

Will Conley, J. Fung Chen, Stephen D. Hsu, 2004, SPIE Advanced Lithography.

CPL mask technology for sub-100-nm contact hole imaging

Kevin D. Lucas, Christopher J. Progler, J. Fung Chen, 2004, Photomask Japan.

Application of Chromeless Phase Lithography (CPL) masks in ArF lithography

Will Conley, Christopher J. Progler, Robert J. Socha, 2002, Photomask Technology.

Complex 2D pattern lithography at λ/4 resolution using chromeless phase lithography (CPL)

John S. Petersen, Stephen Hsu, Robert J. Socha, 2002, SPIE Advanced Lithography.

Mighty high-T lithography for 65-nm generation contacts

Vincent Wiaux, Geert Vandenberghe, Will Conley, 2003, SPIE Advanced Lithography.

Development of a sub-100nm integrated imaging system using chromeless phase-shifting imaging with very high NA KrF exposure and off-axis illumination

Will Conley, John S. Petersen, David J. Gerold, 2002, SPIE Advanced Lithography.

Model-based scattering bars implementation for 65nm and 45nm nodes using IML technology

Stephen Hsu, Robert Socha, Michael Hsu, 2005, Photomask Japan.

Designing dual-trench alternating phase-shift masks for 140-nm and smaller features using 248-nm KrF and 193-nm ArF lithography

Martin McCallum, John S. Petersen, J. Fung Chen, 1998, Photomask and Next Generation Lithography Mask Technology.

Manufacturing an advanced process characterization reticle incorporating halftone biasing

Kent H. Nakagawa, J. Fung Chen, Douglas J. Van Den Broeke, 1999, European Mask and Lithography Conference.

Halftone biasing OPC technology: an approach for achieving fine bias control on raster-scan systems

Kent H. Nakagawa, J. Fung Chen, Robert J. Socha, 1999, Photomask and Next Generation Lithography Mask Technology.

Resolution enhancement with high-transmission attenuating phase-shift masks

Will Conley, John S. Petersen, Robert J. Socha, 1999, Photomask and Next Generation Lithography Mask Technology.

Near-0.3 k1 full pitch range contact hole patterning using chromeless phase lithography (CPL)

Robert Socha, Stephen D. Hsu, Douglas J. Van Den Broeke, 2003, SPIE Photomask Technology.

RET masks for the final frontier of optical lithography

Jungchul Park, Sangbong Park, Ting Chen, 2005, Photomask Japan.

Line end shortening in CPL mask technology

Will Conley, Robert John Socha, Chris Progler, 2005 .

Method for calibration and optimization of a two-dimensional modeling of patterns

Uwe Hollerbach, Kurt E. Wampler, Jang Fung Cupertino Chen, 2002 .

Eigen-decomposition-based models for model OPC

J. Fung Chen, Stephen D. Hsu, Douglas J. Van Den Broeke, 2004, Photomask Japan.

Design of 200-nm, 170-nm, and 140-nm DUV contact sweeper high-transmission attenuating phase-shift mask: II. Experimental results

Will Conley, Christophe Pierrat, Robert John Socha, 1999, Advanced Lithography.

CD error sensitivity to "sub-killer" defects at k1 near 0.4: II

Kent H. Nakagawa, J. Fung Chen, Robert J. Socha, 1999, Photomask Technology.

OPC technology road map to 0.14-μm design rules

J. Fung Chen, Douglas J. Van Den Broeke, Kurt E. Wampler, 1997, Photomask Technology.

Tuning MEEF for CD control at 65nm node based on Chromeless Phase Lithography (CPL)

Stephen Hsu, J. Fung Chen, Douglas J. Van Den Broeke, 2002, Photomask Technology.

Contact hole reticle optimization by using interference mapping lithography (IML)

Stephen D. Hsu, Robert J. Socha, Douglas J. Van Den Broeke, 2004, Photomask Japan.

Full-chip manufacturing reliability check and correction (MRC2): a first step toward design for manufacturability with low k1 lithography

Stephen Hsu, J. Fung Chen, Michael Hsu, 2004, SPIE Photomask Technology.

Crossing the divide between lithography and chip design

William H. Arnold, J. Fung Chen, Kurt E. Wampler, 2002, SPIE Advanced Lithography.

An OPC technology roadmap to 0.14μm design rules

J. Fung Chen, Kurt E. Wampler, Roger F. Caldwell, 1998 .

Lithography manufacturing implementation for 65 nm and 45 nm nodes with model-based scattering bars using IML technology

Stephen Hsu, Robert Socha, Michael Hsu, 2004, SPIE Advanced Lithography.

OPC model calibration for CPL patterning at extreme low k1

Linda Yu, Stephen Hsu, J. Fung Chen, 2004, SPIE Photomask Technology.

65-nm full-chip implementation using double dipole lithography

Will Conley, Tsann-Bim Chiou, Jo Finders, 2003, SPIE Advanced Lithography.

Low k1 lithography patterning option for the 90-nm and 65-nm nodes

J. Fung Chen, Stephen D. Hsu, Douglas J. Van Den Broeke, 2003, Photomask Japan.

Development of a sub-100-nm integrated imaging system using chromeless phase-shifting imaging with very high NA KrF exposure and off-axis illumination

Will Conley, John S. Petersen, David J. Gerold, 2002, SPIE Advanced Lithography.

CPL reticle technology for advanced device applications

Kevin D. Lucas, Philippe Thony, Christopher J. Progler, 2004, Photomask Japan.

Contact and via hole mask design optimization for 65-nm technology node

Stephen Hsu, Robert Socha, J. Fung Chen, 2004, SPIE Photomask Technology.

Practical method for full-chip optical proximity correction

J. Fung Chen, Kurt E. Wampler, Roger F. Caldwell, 1997, Advanced Lithography.

Application of CPL with Interference Mapping Lithography to generate random contact reticle designs for the 65-nm node

J. Fung Chen, Stephen D. Hsu, Robert J. Socha, 2004, Photomask Japan.

Full-chip manufacturing reliability check implementation for 90-nm and 65-nm nodes using CPL and DDL

J. Fung Chen, Stephen D. Hsu, Douglas J. Van Den Broeke, 2004, Photomask Japan.

The impact of MEEF through pitch for 120-nm contact holes

Will Conley, Kevin D. Lucas, Robert John Socha, 2004, SPIE Advanced Lithography.

Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond

Stephen Hsu, Jo Finders, Robert John Socha, 2002, SPIE Advanced Lithography.

Design and analysis of across-chip linewidth variation for printed features at 130 nm and below

Greg Yeric, Robert John Socha, Mircea Dusa, 2000, Advanced Lithography.

CD error sensitivity to "sub-killer" defects at k1 near 0.4

Kent H. Nakagawa, J. Fung Chen, Robert J. Socha, 1999, Advanced Lithography.

Mask design optimization for 70-nm technology node using chromeless phase lithography (CPL) based on 100% transmission phase-shifting mask

Stephen Hsu, J. Fung Chen, Douglas J. Van Den Broeke, 2002, Photomask Japan.

Making high-performance scattering-bar OPC masks with vector-scan, variable-shaped e-beam, and raster-scan laser mask writers

J. Fung Chen, Kurt E. Wampler, Roger F. Caldwell, 1998, Photomask Technology.

The application of CPL reticle technology for the 0.045-mm node

Will Conley, Kevin D. Lucas, Fung Chen, 2004, SPIE Advanced Lithography.

Practical technology path to sub-0.10-μm process generations via enhanced optical lithography

Kent H. Nakagawa, J. Fung Chen, Thomas Laidig, 1999, Photomask Technology.

Advanced 193 tri-tone EAPSM (9%-18%) for 65 nm node

Will Conley, Greg P. Hughes, Laurent Dieu, 2002, Photomask Technology.

Investigation of model OPC optimization based on CD uniformity yield

Uwe Hollerbach, J. Fung Chen, Thomas Laidig, 2003, SPIE Advanced Lithography.

Application of CPL reticle technology for the 65- and 50-nm node

Douglas J. Van Den Broeke, Kurt E. Wampler, Thomas L. Laidig, 2003, SPIE Advanced Lithography.

Complex two-dimensional pattern lithography using chromeless phase lithography

Kurt E. Wampler, R. Socha, S. Hsu, 2002 .

Design of 200nm, 170nm, 140nm DUV contact sweeper high transmission attenuating phase shift mask through simulation. Part 1

Robert John Socha, Fung Chen, John S. Petersen, 1998 .

Design of 200nm, 170nm, 140nm DUV contact sweeper high transmission attenuating phase shift mask : Experimental results Part 2

Will Conley, Bo Su, Fung Chen, 1999 .