Pei-I Wang

Bias-temperature stress of Al on porous low-k dielectrics

Ming He, Toh-Ming Lu, Huafang Li, 2011, Microelectron. Reliab..

Low Temperature Copper-Nanorod Bonding for 3D Integration

Jian Yu, Gopal G. Pethuraja, Tansel Karabacak, 2006 .

Real time resistivity measurements during sputter deposition of ultrathin copper films

Toh-Ming Lu, Pei-I Wang, T. Lu, 2002 .

Low Temperature Wafer Bonding by Copper Nanorod Array

Jian-Qiang Lu, Toh-Ming Lu, Tansel Karabacak, 2009 .

Molecular Layer Chemistry via Parylenes

Jay J. Senkevich, Pei-I Wang, 2009 .

Phase transformation of single crystal β-tungsten nanorods at elevated temperatures

Toh-Ming Lu, Tansel Karabacak, Gwo-Ching Wang, 2005 .

Kinetics of Ta ions penetration into porous low-k dielectrics under bias-temperature stress

Toh-Ming Lu, Ming He, Pei-I Wang, 2010 .