Ghazali Omar

Effect of wafer thinning methods towards fracture strength and topography of silicon die

Azman Jalar, Ibrahim Ahmad, Hoh Huey Jiun, 2006, Microelectron. Reliab..

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

Azman Jalar, Ibrahim Ahmad, Mohd Khairuddin Md Arshad, 2006, Microelectron. Reliab..