W.W.M. Siu

Die Cracking Risks in Adding a Heatslug to a QFP Package

S.H.K. Lee, N. Fan, S.C.H. Ip, 2000 .

Transient temperature computation of spheres in three-dimensional random packings

W.W.M. Siu, S. H. Lee, S. H.-K. Lee, 2004 .

Effective conductivity computation of a packed bed using constriction resistance and contact angle effects

W.W.M. Siu, S. H. Lee, S. H.-K. Lee, 2000 .

Transient effect on the constriction resistance between spheres

W.W.M. Siu, S. H. Lee, S. H.-K. Lee, 2000 .