Gu-Sung Kim

Integrated passive device for TSV (Through-Silicon-Via) interposer

Gu-Sung Kim, 2017, 2017 International Conference on Electronics Packaging (ICEP).

The electrical, mechanical properties of through-silicon-via insulation layer for 3D ICs

Jae-Hyun Park, Gu-Sung Kim, Jae-Hyun Park, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

A study of hot consolidation properties for recycled silicon powder

Hyungsik Chung, Man-Sik Kong, Hang-Chul Jung, 2011 .