Barry C. Johnson

The effect of die attach voiding on the thermal resistance of chip level packages

Amy S. Fleischer, Li-hsin Chang, Barry C. Johnson, 2006, Microelectron. Reliab..

Highly-Efficient Advanced Thermoelectric Devices from Different Multilayer Thin Films

Mebougna L. Drabo, Barry C. Johnson, Zhigang Xiao, 2016 .

The effect of die attach voiding on the thermal resistance of chip level packages

Barry C. Johnson, A. Fleischer, Li-hsin Chang, 2006, Microelectron. Reliab..