K. Atsumi

The impact of "digital manufacturing" on technology management

Takehisa Seino, Y. Ikeda, M. Kinoshita, 2001, PICMET '01. Portland International Conference on Management of Engineering and Technology. Proceedings Vol.1: Book of Summaries (IEEE Cat. No.01CH37199).

High-accuracy inner lead bonding technique

K. Okano, Noriyasu Kashima, K. Atsumi, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium.

Inner lead bonding techniques for 500 lead dies having a 90 mu m lead pitch

K. Atsumi, Y. Maehara, N. Kashima, 1989, Proceedings., 39th Electronic Components Conference.

Inner lead bonding techniques for 500 lead dies having a 90 mu m lead pitch

Noriyasu Kashima, K. Atsumi, Y. Maehara, 1989 .