Rehan Khalid
发表
Aaron P. Wemhoff,
Yogendra Joshi,
Rehan Khalid,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yogendra Joshi,
Rehan Khalid,
Aaron Wemhoff,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).