Hui-Wang Cui

Study on the Reliability of Fast Curing Isotropic Conductive Adhesive

Si Chen, Zhichao Yuan, Lilei Ye, 2011 .

Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

Qiong Fan, Hui-Wang Cui, Dong‐sheng Li, 2013 .

Reliability of flexible electrically conductive adhesives

Qiong Fan, Hui-Wang Cui, Dong‐sheng Li, 2013 .