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N5 technology node dual-damascene interconnects enabled using multi patterning

S. Decoster, J. Ryckaert, K. Croes, 2017, 2017 IEEE International Interconnect Technology Conference (IITC).

N5 BEOL Process Options Patterning flows Comparing 193immersion to Hybrid EUV or Full EUV

Ming Mao, Joost Bekaert, Victor Blanco, 2017 .