Sien Kang

High Temperature Oxygen Out-Diffusion from the Interfacial SiOx Bond Layer in Direct Silicon Bonded (DSB) Substrates

J. Sullivan, H.R. Kirk, P.J. Ong, 2006, 2006 IEEE international SOI Conferencee Proceedings.

Beam-induced wafering technology for kerf-free thin PV manufacturing

Francois Henley, Sien Kang, Zuqin Liu, 2009, 2009 34th IEEE Photovoltaic Specialists Conference (PVSC).

Direct Film Transfer (DFT) Technology for Kerf-Free Silicon Wafering

Sien Kang, Zuqin Liu, Zuqin Liu, 2008 .