A.N.R. Wagiman

Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate

C.C. Loke, Chin-Thong Cheong, Hun-Song Goh, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Solder joint fatigue in a surface-mount assembly subjected to mechanical loading

W. K. Loh, Y. B. Liew, A.N.R. Wagiman, 2005, 2005 7th Electronic Packaging Technology Conference.

Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading

Yek Ban Liew, W. K. Loh, Y. B. Liew, 2007, IEEE Transactions on Components and Packaging Technologies.