K.-D. Lang

Embedding of wearable electronics into smart sensor insole

M. Hubl, O. Pohl, V. Noack, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Through mold via technology for multi-sensor stacking

R. Aschenbrenner, T. Braun, K.-F. Becker, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias

Ha-Duong Ngo, Oswin Ehrmann, P. Mackowiak, 2013, Microtechnologies for the New Millennium.

Insertion loss study for panel-level single-mode glass waveguides

K.-D. Lang, M. Neitz, J. Röder-Ali, 2017, OPTO.

Modular microelectronics by System-in-Packages with embedded components

D. Manessis, A. Ostmann, K.-D. Lang, 2011, 18th European Microelectronics & Packaging Conference.

On the Way from Fan-out Wafer to Fan-out Panel Level Packaging

J. Bauer, R. Aschenbrenner, K.-D. Lang, 2016 .

System-in-Packages with embedded components for modular systems

D. Manessis, A. Ostmann, K.-D. Lang, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Measurement of Young's modulus and residual stress of thin SiC layers for MEMS high temperature applications

Ha-Duong Ngo, Tolga Tekin, Ernst Obermeier, 2011, Microtechnologies.

Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from Aluminum and Copper on silicon wafer substrate

K.-D. Lang, H. J. Eichler, V. Glaw, 2017, 2017 Conference on Lasers and Electro-Optics (CLEO).

Copper filling of TSVs for interposer applications

O. Ehrmann, K.-D. Lang, A. Uhlig, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd:YAG laser: An experiment-based parameter optimization guide

K.-D. Lang, H. J. Eichler, V. Glaw, 2017, 2017 Conference on Lasers and Electro-Optics (CLEO).