W. Zhang

Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads

M. Kaynak, F. Korndorfer, M. Wietstruck, 2012, 2012 IEEE/MTT-S International Microwave Symposium Digest.

Electro-thermo-mechanical analysis of a BiCMOS embedded RF-MEMS switch for temperatures from −55°C to + 125°C

M. Kaynak, M. Wietstruck, B. Tillack, 2013, 2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

EM and lumped-element model of BiCMOS embedded capacitive RF-MEMS switch

M. Kaynak, M. Wietstruck, B. Tillack, 2012, 2012 The 7th German Microwave Conference.

RF-MEMS switch module in a 0.25 μm BiCMOS technology

H. Schumacher, M. Kaynak, F. Korndorfer, 2012, 2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

An accurate and versatile equivalent circuit model for RF-MEMS circuit optimization in BiCMOS technology

R. Plana, M. Kaynak, B. Tillack, 2012, 2012 7th European Microwave Integrated Circuit Conference.

Smart phase-only micromirror array fabricated by standard CMOS process

W. Zhang, A. Tuantranont, Y.C. Lee, 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

Study of RF flip-chip assembly with underfill epoxy

K. C. Gupta, W. Zhang, Yung-Cheng Lee, 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).