Kenshi Fukumitsu

Analysis of internal crack propagation in silicon due to permeable pulse laser irradiation: study on processing mechanism of stealth dicing

Etsuji Ohmura, Yuta Kawahito, Kenshi Fukumitsu, 2010, Fundamentals of Laser Assisted Micro- and Nanotechnologies.

Laser microprocessing unit and its application

Kenshi Fukumitsu, Tomonori Oie, 2000, International Symposium on Laser Precision Microfabrication.

A method for cutting a processed object

Kenshi Fukumitsu, Fumitsugu Fukuyo, 2003 .

Compact, rigid, and high-power ultrafast laser system applying a glass-block cavity

Kenshi Fukumitsu, Koei Yamamoto, Masatoshi Fujimoto, 2009, LASE.

A method of cutting an object along two different directions by additionally using an elastic sheet to divide the object

Naoki Uchiyama, Kenshi Fukumitsu, Fumitsugu Fukuyo, 2001 .

Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer

Etsuji Ohmura, Kenshi Fukumitsu, Hideki Morita, 2007 .

Thermo-Elastic-Plastic Analysis on Internal Processing Phenomena of Single-Crystal Silicon by Nanosecond Laser

Etsuji Ohmura, Kenshi Fukumitsu, Hideki Morita, 2006 .

Internal modified-layer formation mechanism into silicon with nanosecond laser

Etsuji Ohmura, Kenshi Fukumitsu, Hideki Morita, 2006 .