B. Wei

发表

J.H. Zhang, B. Wei, B. Wei, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

T. Fukuda, B. Wei, T. Okada, 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.

J.H. Zhang, B. Wei, C.Y. Li, 2008, 2008 58th Electronic Components and Technology Conference.