B. M. Guenin

Reliability and performance of non-hermetic, surface-mount quad flat packages

B. M. Guenin, D. Mahulikar, D. C. Leslie, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Analysis of thermally-enhanced SOIC packages

B. M. Guenin, A. R. Chowdhury, R. L. Groover, 1996 .

Thermally-enhanced SOIC packages for power IC devices

B. M. Guenin, A. R. Chowdhury, R. L. Groover, 1996, 8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings.

Analysis of a thermally enhanced ball grid array package

B. M. Guenin, R. C. Marrs, R. J. Molnar, 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Methodology for thermal evaluation of multichip modules

B. M. Guenin, R. J. Molnar, B. S. Lall, 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

The Use of Spreadsheets in Packaging Thermal Calculations

B. M. Guenin, 1998, Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).

Parametric FEA thermal model for QFP packages

B. M. Guenin, B. S. Lall, R. C. Marrs, 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

Methodology for the thermal characterization of the MQUAD microelectronic package

B. M. Guenin, D. Mahulikar, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Transient thermal model for the MQUAD microelectronic package

B. M. Guenin, 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).