Dave Horak

EUV lithography at the 22nm technology node

John Arnold, Sudhar Raghunathan, Sander Bouten, 2010, Advanced Lithography.

Fabrication of dual damascene BEOL structures using a multilevel multiple exposure (MLME) scheme, part 2: RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain

Steven J. Holmes, Nicolette Fender, Dave Horak, 2010, Advanced Lithography.

Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects

Andrew Metz, Karen Petrillo, Dave Horak, 2009, Advanced Lithography.

Integration of EUV lithography in the fabrication of 22-nm node devices

John Arnold, Sudhar Raghunathan, Yunfei Deng, 2009, Advanced Lithography.

Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node

Karen Petrillo, Andrew Metz, Shinichiro Kawakami, 2010, Advanced Lithography.