Theodorus Standaert

EUV lithography at the 22nm technology node

John Arnold, Sudhar Raghunathan, Sander Bouten, 2010, Advanced Lithography.

Hybridization of XRF/XPS and scatterometry for Cu CMP process control

Theodorus Standaert, Robin Chao, John Gaudiello, 2015, Advanced Lithography.

Fin width scaling for improved short channel control and performance in aggressively scaled channel length SOI finFETs

Andres Bryant, Theodorus Standaert, Tenko Yamashita, 2013, 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Modeling of width-quantization-induced variations in logic FinFETs for 22nm and beyond

Phil Oldiges, Wilfried Haensch, Andres Bryant, 2011, 2011 Symposium on VLSI Technology - Digest of Technical Papers.

Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes

Wei Wang, Raghuveer Patlolla, Elbert Huang, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Opportunities and Challenges of FinFET as a Device Structure Candidate for 14nm Node CMOS Technology

Andres Bryant, Theodorus Standaert, Tenko Yamashita, 2011 .