Brian Lee

发表

EUV lithography at the 22nm technology node

John Arnold, Sudhar Raghunathan, Sander Bouten, 2010, Advanced Lithography.

Design, performance, and early results from extremely high Doppler precision instruments in a global network

Peng Jiang, Frank Varosi, Bo Zhao, 2010, Astronomical Telescopes + Instrumentation.

The use of EUV lithography to produce demonstration devices

John Arnold, Harry J. Levinson, Sander Bouten, 2008, SPIE Advanced Lithography.

A new generation multi-object Doppler instrument for the SDSS-III Multi-object APO Radial Velocity Exoplanet Large-area Survey

Fred Hearty, Frank Varosi, Bo Zhao, 2009, Optical Engineering + Applications.

An investigation of EUV lithography defectivity

Yunfei Deng, Youri van Dommelen, Bruno La Fontaine, 2008, Photomask Technology.

Data Processing Factory for the Sloan Digital Sky Survey

Robert Sparks, Brian Lee, Dan Yocum, 2002, SPIE Astronomical Telescopes + Instrumentation.

Modeling of Reverse Tone Etchback Shallow Trench Isolation Chemical Mechanical Polishing

Duane S. Boning, Terence Gan, Brian Lee, 2001 .

Nanotopography effects on chemical mechanical polishing for shallow trench isolation

Duane S. Boning, Noel Poduje, Brian Lee, 2000, 2000 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 2000 (Cat. No.00CH37072).

USING SMART DUMMY FILL AND SELECTIVE REVERSE ETCHBACK FOR PATTERN DENSITY EQUALIZATION

Duane S. Boning, Brian Lee, David J. Stein, 2000 .

Wafer Nanotopography Effects on CMP: Experimental Validation of Modeling Methods

Duane S. Boning, John Francis Valley, Noel Poduje, 2001 .

MODELING OF PATTERN DEPENDENCIES FOR MULTI-LEVEL COPPER CHEMICAL-MECHANICAL POLISHING PROCESSES

Duane S. Boning, Brian Lee, Tamba Tugbawa, 2001 .

Nanotopography Issues in Shallow Trench Isolation CMP

Duane S. Boning, Brian Lee, 2002 .

Modeling and Mapping of Nanotopography Interactions with CMP

Duane S. Boning, John Francis Valley, Noel Poduje, 2002 .