Rao R. Tummala
发表
Rao R. Tummala,
R. Tummala,
2017,
2017 IEEE International Electron Devices Meeting (IEDM).
Joungho Kim,
Venky Sundaram,
Youngwoo Kim,
2013,
2013 IEEE International 3D Systems Integration Conference (3DIC).
Venky Sundaram,
Youngwoo Kim,
Jonghyun Cho,
2013,
3DIC.
Madhavan Swaminathan,
Daehyun Chung,
Rao R. Tummala,
2009,
2009 IEEE International Conference on 3D System Integration.
Venky Sundaram,
Qiao Chen,
Rao R. Tummala,
2009,
2009 IEEE Custom Integrated Circuits Conference.
Joy Laskar,
Rao R. Tummala,
R. Tummala,
2004,
Proceedings of the IEEE.
Joungho Kim,
Venky Sundaram,
Jonghyun Cho,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Xi Liu,
Qiao Chen,
Suresh K. Sitaraman,
2013,
Microelectron. Reliab..
Rao R. Tummala,
John U. Knickerbocker,
Raj N. Master,
1992,
IBM J. Res. Dev..
Rao R. Tummala,
Mark D. Mayo,
James P. Eckhardt,
1991,
[1991 Proceedings] IEEE International Conference on Computer Design: VLSI in Computers and Processors.
Vijay K. Madisetti,
Rao R. Tummala,
1999,
IEEE Des. Test Comput..
Michael Pecht,
Rao R. Tummala,
1995
.
Min Suk Kim,
Joungho Kim,
Kyungjun Cho,
2018,
Microelectron. J..
Joungho Kim,
Venky Sundaram,
Heegon Kim,
2014,
2014 International 3D Systems Integration Conference (3DIC).
Venky Sundaram,
Rao R. Tummala,
Sangbeom Cho,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Venky Sundaram,
Abhishek Choudhury,
Rao R. Tummala,
2009,
2009 59th Electronic Components and Technology Conference.
Madhavan Swaminathan,
Rao R. Tummala,
Hirokazu Ito,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Suresh K. Sitaraman,
Rao R. Tummala,
Venkatesh Sundaram,
2014,
IEEE Transactions on Device and Materials Reliability.
Joungho Kim,
Venky Sundaram,
Srikrishna Sitaraman,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Himani Sharma,
Markondeya Raj Pulugurtha,
Rao R. Tummala,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Donald P. Seraphim,
Rao R. Tummala,
R. Tummala,
1989
.
Venky Sundaram,
Junki Min,
Markondeya Raj Pulugurtha,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Andrew F. Peterson,
Venky Sundaram,
Kadappan Panayappan,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Manos M. Tentzeris,
Venky Sundaram,
Rao R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Madhavan Swaminathan,
Venky Sundaram,
2009,
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
Pulugurtha Markondeya Raj,
Manos M. Tentzeris,
Rao R. Tummala,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Pulugurtha Markondeya Raj,
Kyungjun Cho,
2017,
IEEE Transactions on Electromagnetic Compatibility.
Venky Sundaram,
Markondeya Raj Pulugurtha,
Rao R. Tummala,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Joungho Kim,
Seungtaek Jeong,
Junki Min,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Suresh K. Sitaraman,
Rao R. Tummala,
Venkatesh Sundaram,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Rao R. Tummala,
Tadahiko Hanada,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Rao R. Tummala,
Hirokazu Ito,
R. Tummala,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
Himani Sharma,
P. M. Raj,
Rao R. Tummala,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Madhavan Swaminathan,
Rui Zhang,
Rao R. Tummala,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Suresh K. Sitaraman,
Rao R. Tummala,
Yoichiro Sato,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Manos M. Tentzeris,
Bijan Tehrani,
Venky Sundaram,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Bartlet DeProspo,
Chandrasekharan Nair,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Manos M. Tentzeris,
Fuhan Liu,
Rao R. Tummala,
2018,
IEEE Microwave and Wireless Components Letters.
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Suresh K. Sitaraman,
Rao R. Tummala,
Yoichiro Sato,
2016,
IEEE Transactions on Device and Materials Reliability.