T. Licht

Reliability testing of high-power multi-chip IGBT modules

Gerhard Mitic, Guy Lefranc, T. Licht, 2000 .

Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics

Golta Khatibi, Brigitte Weiss, Herbert Danninger, 2010 .

A solder bumping interconnect technology for high-power devices

T. Licht, M. Zellner, K. Hase, 2004, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).

IGBT module technology with high partial discharge resistance

G. Mitic, G. Lefranc, T. Licht, 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).