John H. L. Pang

发表

Fibre optic sensors for load-displacement measurements and comparisons to piezo sensor based electromechanical admittance signatures

Anand Asundi, Venu Gopal Madhav Annamdas, Muneesh Maheshwari, 2015, Smart Structures.

Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability

John H. L. Pang, Kar Hwee Ang, X. Q. Shi, 2001 .

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging

Chak-Kuen Wong, John H. L. Pang, J. W. Tew, 2008, Microelectron. Reliab..

Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages

John H. L. Pang, F. X. Che, Desmond Y. R. Chong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

John H. L. Pang, D.Y.R. Chong, J. Pang, 2001 .

Finite Element Analysis and Design-for-Reliability

John H. L. Pang, 2012 .

Damage monitoring using fiber optic sensors and by analysing electro-mechanical admittance signatures obtained from piezo sensor

Anand Asundi, Venu Gopal Madhav Annamdas, Muneesh Maheshwari, 2015, SPIE Micro + Nano Materials, Devices, and Applications.

Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief

Mehmet Arik, Patrick McCluskey, Bahgat Sammakia, 2009 .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES BOARD OF GOVERNORS (Continued on back cover)

Michael Pecht, Bahgat Sammakia, Avram Bar-Cohen, 2005 .

Digital image correlation for solder joint fatigue reliability in microelectronics packages

Yaofeng Sun, John H. L. Pang, J. Pang, 2008, Microelectron. Reliab..

Vibration reliability test and finite element analysis for flip chip solder joints

John H. L. Pang, F. X. Che, 2009, Microelectron. Reliab..

Study on reliability of PQFP assembly with lead free solder joints under random vibration test

John H. L. Pang, F. X. Che, F. Che, 2015, Microelectron. Reliab..

Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system

John H. L. Pang, X. Q. Shi, X. R. Zhang, 2004, Microelectron. Reliab..

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

K. H. Low, Yuqi Wang, Kay Hiang Hoon, 2006, Microelectron. Reliab..

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Jianmin Miao, John H. L. Pang, Robert Preisser, 2007 .

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

John H. L. Pang, J. Pang, B. Xiong, 2004 .

Electrochemical capacitive properties of CNT fibers spun from vertically aligned CNT arrays

Feng Yu, Lianxi Zheng, John H. L. Pang, 2012, Journal of Solid State Electrochemistry.

Flip chip solder joint fatigue life model investigation

A. Yeo, John H. L. Pang, C. Lee, 2002, 4th Electronics Packaging Technology Conference, 2002..

Determination of interface fracture toughness of adhesive joint subjected to mixed-mode loading using finite element method

John H. L. Pang, X. R. Zhang, J. Pang, 2006 .

Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen

Xunqing Shi, John H. L. Pang, Z. P. Wang, 2001 .

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

John H. L. Pang, Z. P. Wang, J. Pang, 2000 .

Influence of Weld Toe Radii on Fatigue Life Prediction

John H. L. Pang, Hsin Jen Hoh, Kin Shun Tsang, 2018 .

Electromigration induced ductile-to-brittle transition in lead-free solder joints

John H. L. Pang, Jae-Woong Nah, King-Ning Tu, 2006 .

Design for reliability (DFR) methodology for electronic packaging assemblies

John H. L. Pang, Fa Xing Che, B. Xiong, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

John H. L. Pang, Fa Xing Che, F. Che, 2007 .

Thermal cycling analysis of flip-chip solder joint reliability

John H. L. Pang, D.Y.R. Chong, J. Pang, 2001 .

Fatigue Monitoring of Double Surface Defects Using PZT Based Electromechanical Impedance and Digital Image Correlation Methods

Kun Zhou, Venu Gopal Madhav Annamdas, John H. L. Pang, 2014 .

Low cycle fatigue models for lead-free solders

John H. L. Pang, J. Pang, B. Xiong, 2004 .

ANALYSIS OF UNDERFILL ENCAPSULATION CURING DEFORMATIONS ON FLIP CHIP ON BOARD (FCOB) PACKAGE RELIABILITY

John H. L. Pang, J. Pang, T. I. Tan, 1998 .

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

John H. L. Pang, Fa Xing Che, 2015, IEEE Transactions on Device and Materials Reliability.

Application of digital speckle correlation to micro-deformation measurement of a flip chip assembly

John H. L. Pang, X. R. Zhang, X. Q. Shi, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Experimental and numerical investigations of near-crack-tip deformation in a solder alloy

John H. L. Pang, J. Pang, Yaofeng Sun, 2008 .

Thermo-mechanical model for simulating laser cladding induced residual stresses with single and multiple clad beads

Guijun Bi, John H. L. Pang, Youxiang Chew, 2015 .

Mechanical failure strength characterization of silicon dice

John H. L. Pang, W. E. Lee, T. H. Low, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).