Li Hong Yu

Design of the Typical Claw Structure Using the Technology of LFC

Xian Zhang Feng, Yan Mei Cui, Li Hong Yu, 2013 .

Research on Calibration of Semiconductor DC Tiny Current Source

Chong Liu, Li Hong Yu, Ying Chun Xu, 2013 .

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)

Jong-Kai Lin, Roshan Weerasekera, Songbai Zhang, 2015, IEEE Design & Test.

Application of CNC Programming Technology in the during of Processing for the Key Parts of Disappearing Mould

Jing Li, Xian Zhang Feng, Yan Mei Cui, 2012 .

Application of Integrated Design of the Belt Drive System Based on the Platform of Research and Development of the VBA

Xian Zhang Feng, Yan Mei Cui, Li Hong Yu, 2013 .

Design and fabrication of a reliability test chip for 3D-TSV

Li Hong Yu, C. T. Chong, Chai Tai Chong, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Li Hong Yu, C. T. Chong, 2009, 2009 11th Electronics Packaging Technology Conference.

Non-destructive testing of a high dense small dimension through silicon via (TSV) array structures by using 3D X-ray computed tomography method (CT scan)

Li Hong Yu, C. C. Kuo, Cheng Cheng Kuo, 2010, 2010 12th Electronics Packaging Technology Conference.

Design for reliability in via middle and via last 3-D chipstacks incorporating TSVs

N. Khan, Li Hong Yu, Cheng Cheng Kuo, 2010, 2010 12th Electronics Packaging Technology Conference.

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

D. Pinjala, J. H. Lau, V. Kripesh, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.