J. Mazuir

3D embedded wafer-level packaging technology development for smart card SIP application

G. Simon, M. Saadaoui, G Pares, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

3D multi-stacking of thin dies based on TSV and micro-inserts interconnections

N. Launay, Jean-Charles Souriau, K. Inal, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY

N. Sillon, S. Moreau, G. Parès, 2011 .

Evaluation and optimization of die-shift in Embedded Wafer-Level Packaging by enhancing the adhesion strength of silicon chips to carrier wafer

K. Inal, M. Saadaoui, G. Pares, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.