A. Planchais

3D embedded wafer-level packaging technology development for smart card SIP application

G. Simon, M. Saadaoui, G Pares, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Evaluation and optimization of die-shift in Embedded Wafer-Level Packaging by enhancing the adhesion strength of silicon chips to carrier wafer

K. Inal, M. Saadaoui, G. Pares, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.