S. Grivet-Talocia

发表

M.S. Nakhla, P. Triverio, S. Grivet-Talocia, 2007, 2007 IEEE Electrical Performance of Electronic Packaging.
I. S. Stievano, S. Grivet-Talocia, G. Signorini, 2015, 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI).
M. Paggi, S. Grivet-Talocia, S. O. Ojo, 2015, 1505.05361.
S. Grivet-Talocia, G. Signorini, C. Siviero, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).
R. Achar, M.S. Nakhla, P. Triverio, 2007, IEEE Transactions on Advanced Packaging.
P. Triverio, S. Grivet-Talocia, A. Chinea, 2010, 2010 IEEE 14th Workshop on Signal Propagation on Interconnects.
S. Grivet-Talocia, A. Chinea, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
S. Grivet-Talocia, M. De Stefano, T. Bradde, 2018, 2018 13th European Microwave Integrated Circuits Conference (EuMIC).
S. Grivet-Talocia, F.G. Canavero, P. Brenner, 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.
S. Grivet-Talocia, F. Canavero, 1999, 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).
S. Grivet-Talocia, A. Chinea, P. Triverio, 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems.
S. Grivet-Talocia, F. Canavero, 2006, 2006 1st Electronic Systemintegration Technology Conference.
I. Maio, S. Grivet-Talocia, I. Stievano, 2002, 2002 IEEE International Symposium on Electromagnetic Compatibility.
P. Triverio, S. Grivet-Talocia, M. S. Nakhla, 2010, 2010 IEEE 14th Workshop on Signal Propagation on Interconnects.
S. Grivet-Talocia, I. Kelander, P. Kotiranta, 2009, 2009 20th International Zurich Symposium on Electromagnetic Compatibility.
S. Grivet-Talocia, F. Canavero, H. Kruger, 2002, Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects.
S. Salio, S. Grivet-Talocia, F. Canavero, 1997, 1997 Proceedings of International Symposium on Electromagnetic Compatibility.
S. Grivet-Talocia, I.S. Stievano, F.G. Canavero, 2002, 4th Electronics Packaging Technology Conference, 2002..
S. Grivet-Talocia, F. Canavero, 1999, 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).
S. Grivet-Talocia, 2003, IEEE Microwave and Wireless Components Letters.
S. Grivet-Talocia, 2017, 2017 International Conference on Electromagnetics in Advanced Applications (ICEAA).
S. Grivet-Talocia, G. Signorini, C. Siviero, 2016, 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS).
S. Grivet-Talocia, A. Ubolli, M. Bandinu, 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.
P. Triverio, S. Grivet-Talocia, A. Chinea, 2009, 2009 IEEE Workshop on Signal Propagation on Interconnects.
S. Grivet-Talocia, I.S. Stievano, I.A. Maio, 2003, 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446).
S. Grivet-Talocia, F.G. Canavero, I. Kelander, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..
S. Grivet-Talocia, V. Loggia, 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI).
I. Maio, S. Grivet-Talocia, F. Canavero, 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).
E. Klink, D. Kaller, G.A. Katopis, 2004, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, S. Grivet-Talocia, 2004, Electrical Performance of Electronic Packaging - 2004.
M. de Magistris, A. Magnani, S. Grivet-Talocia, 2013, 2013 17th IEEE Workshop on Signal and Power Integrity.
S. Grivet-Talocia, Christian Schuster, Torben Wendt, 2019, 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA).
B. Gustavsen, S. Grivet-Talocia, 2016, IEEE Electromagnetic Compatibility Magazine.
D. Kaller, S. Grivet-Talocia, C. Siviero, 2014, 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI).
S. Grivet-Talocia, P. Brenner, S. B. Olivadese, 2013, 2013 17th IEEE Workshop on Signal and Power Integrity.
S. Grivet-Talocia, A. Ubolli, S. Grivet-Talocia, 2007, 2007 IEEE Workshop on Signal Propagation on Interconnects.
S. Grivet-Talocia, V. Loggia, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
S. Grivet-Talocia, F.G. Canavero, I.A. Maio, 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
S. Grivet-Talocia, F.G. Canavero, M. Bandinu, 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
M.S. Nakhla, P. Triverio, S. Grivet-Talocia, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.
S. Grivet-Talocia, F. Canavero, A.E. Ruehli, 2004, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, A. Chinea, G. C. Calafiore, 2012, 2012 IEEE 16th Workshop on Signal and Power Integrity (SPI).
S. Grivet-Talocia, I.S. Stievano, F.G. Canavero, 2004, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).
S. Grivet-Talocia, M. Rouvala, F. Canavero, 2006, 2006 17th International Zurich Symposium on Electromagnetic Compatibility.
S. Grivet-Talocia, A. Chinea, S. Grivet-Talocia, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Grivet-Talocia, F.G. Canavero, 2002, Electrical Performance of Electronic Packaging,.
S. Grivet-Talocia, T. Bradde, A. Zanco, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).
P. Triverio, S. Grivet-Talocia, S. B. Olivadese, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.
S. Grivet-Talocia, M. De Stefano, T. Bradde, 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI).
P. Triverio, S. Grivet-Talocia, A. Chinea, 2008, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
M. Telescu, S. Grivet-Talocia, G. Signorini, 2018, 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
S. Grivet-Talocia, F. Canavero, 1998, 1998 URSI International Symposium on Signals, Systems, and Electronics. Conference Proceedings (Cat. No.98EX167).
S. Grivet-Talocia, F.G. Canavero, I. Kelander, 2007, IEEE Transactions on Electromagnetic Compatibility.
S. Grivet-Talocia, F.G. Canavero, I. Kelander, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.
S. Grivet-Talocia, V. Loggia, Haisheng Hu, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Grivet-Talocia, V. Loggia, 2011, 10th International Symposium on Electromagnetic Compatibility.
S. Grivet-Talocia, T. Bradde, A. Zanco, 2019, 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE.
E. Klink, D. Kaller, S. Grivet-Talocia, 2002, Electrical Performance of Electronic Packaging,.
S. Grivet-Talocia, H. Hu, 2012, International Symposium on Electromagnetic Compatibility - EMC EUROPE.
S. Grivet-Talocia, 2018, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI).
S. Grivet-Talocia, 2006, 2006 IEEE Electrical Performane of Electronic Packaging.
S. Grivet-Talocia, A. Ubolli, S. Grivet-Talocia, 2006, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).
S. Grivet-Talocia, P. Triverio, 2006, 2006 IEEE Workship on Signal Propagation on Interconnects.
S. Grivet-Talocia, A. Ubolli, 2007, 2007 IEEE Electrical Performance of Electronic Packaging.
S. Grivet-Talocia, A. Chinea, G. C. Calafiore, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.
S. Grivet-Talocia, A. Chinea, 2007, IEEE Microwave and Wireless Components Letters.
S. Grivet-Talocia, A. Ubolli, S. Grivet-Talocia, 2008, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, P. Triverio, M. Nakhla, 2009, IEEE Transactions on Advanced Packaging.
M. S. Nakhla, S. Grivet-Talocia, P. Triverio, 2009, 2009 IEEE Workshop on Signal Propagation on Interconnects.
S. Grivet-Talocia, E. Richalot, U. Kuhl, 2016, 2016 IEEE Metrology for Aerospace (MetroAeroSpace).
Giuseppe C. Calafiore, S. Grivet-Talocia, A. Chinea, 2012, IEEE Transactions on Microwave Theory and Techniques.
S. Grivet-Talocia, S. Grivet-Talocia, 2007, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..
S. Grivet-Talocia, A. Chinea, P. Triverio, 2010, IEEE Transactions on Microwave Theory and Techniques.
S. Grivet-Talocia, A. Chinea, S. Grivet-Talocia, 2008, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, A. Ubolli, S. Grivet-Talocia, 2007, IEEE Transactions on Microwave Theory and Techniques.
S. Grivet-Talocia, A. Chinea, P. Triverio, 2010, IEEE Transactions on Advanced Packaging.
S. Grivet-Talocia, S. B. Olivadese, S. Olivadese, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Grivet-Talocia, P. Triverio, 2006, 2006 Ph.D. Research in Microelectronics and Electronics.
S. Grivet-Talocia, P. Triverio, 2006, 2006 IEEE Electrical Performane of Electronic Packaging.