Yao-Jen Chuang

发表

ECO fill: automated fill modification to support late-stage design changes

Greg Davis, Jeff Wilson, J. J. Yu, 2014, Advanced Lithography.

A novel bubble tolerant thermometer-to-binary encoder for flash A/D converter

Bin-Da Liu, Yao-Jen Chuang, Hsin-Hung Ou, 2005, 2005 IEEE VLSI-TSA International Symposium on VLSI Design, Automation and Test, 2005. (VLSI-TSA-DAT)..