Matthias Heschel

Chip-size-packaged silicon microphones

Matthias Müllenborn, Pirmin Hermann Otto Rombach, Udo Klein, 2001 .

Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

Ole Hansen, Matthias Müllenborn, Pirmin Hermann Otto Rombach, 2000 .

Integrated packaging concept for an intelligent transducer

Matthias Heschel, Siebe Bouwstra, Jochen Kuhmann, 1998, Smart Structures.

Chip-size-packaged silicon microphones [for hearing instruments]

Matthias Müllenborn, Pirmin Hermann Otto Rombach, Udo Klein, 2001 .

Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

Matthias Heschel, Siebe Bouwstra, 1998 .

Flip-chip assembly for photonic circuits

Matthias Heschel, Kerstin Worhoff, Rene G. Heideman, 2004, SPIE Photonics Europe.

Stacking Technology for a Space Constrained Microsystem

Jochen Kuhmann, Matthias Heschel, Siebe Bouwstra, 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.

On the flow behavior of diffuser/nozzle elements microfabricated in silicon

Matthias Müllenborn, Matthias Heschel, Siebe Bouwstra, 1996 .

Fabrication and characterization of truly 3-D diffuser/nozzle microstructures in silicon

Matthias Müllenborn, Matthias Heschel, Siebe Bouwstra, 1997 .

Laser direct etching of silicon on oxide for rapid prototyping

Matthias Müllenborn, Matthias Heschel, Siebe Bouwstra, 1996 .