H. S. Rathore

Reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies

R. A. Susko, H. S. Rathore, G. C. Schwartz, 1989 .

Electromigration improvements with titanium underlay and overlay in Al(Cu) metallurgy

J. J. Estabil, H. S. Rathore, E. N. Levine, 1991, 1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference.