Sueo Kawai

Revival/Leap Strategies of Japanese Manufacturing Industries

Sueo Kawai, 2004 .

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Hideo Miura, Makoto Kitano, Asao Nishimura, 1993 .

Structural effect of IC plastic package on residual stress in silicon chips

H. Miura, A. Nishimura, Sueo Kawai, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Development and application of the stress sensing test chip for IC plastic packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1987 .

Thermal Stress in Silicon Chips Encapsulated in IC Plastic Packages.

Hideo Miura, Kunihiko Nishi, Asao Nishimura, 1991 .

Torsional Fatigue Strength of a Shrink Fitted Shaft

Toshio Hattori, Noriaki Okamoto, Sueo Kawai, 1981 .

Analysis of package cracking during reflow soldering process

Kunihiko Nishi, Makoto Kitano, Asao Nishimura, 1988, 26th Annual Proceedings Reliability Physics Symposium 1988.

A study of package cracking during the reflow soldering process.

Kunihiko Nishi, Makoto Kitano, Asao Nishimura, 1989 .