Wai Leong Ching
发表
Lin Bu,
Ho Siow Ling,
Min Woo Rhee,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Vempati Srinivasa Rao,
Vaidyanathan Kripesh,
Andy Fenner,
2010,
IEEE Transactions on Components and Packaging Technologies.
V. Kripesh,
J. Lau,
Hnin Wai Yin,
2008,
2008 10th Electronics Packaging Technology Conference.