C. Beddingfield

Flip chip assembly of Motorola fast static RAM known good die

C. Beddingfield, D. Kost, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Reliability evaluation of probe-before-bump technology

C. Beddingfield, Qing Tan, A. Mistry, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

Performance of evaporated and plated bumps on organic substrates

C. Beddingfield, J. Guajardo, D. Wontor, 1998, Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205).