Christine H. Tsau

Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

S. Mark Spearing, Konstantinos Stamoulis, Christine H. Tsau, 2005, SPIE MOEMS-MEMS.

Fabrication and characterization of wafer-level gold thermocompression bonding

Christine H. Tsau, 2003 .

Characterization of Low Temperature, Wafer-Level Gold-Gold Thermocompression Bonds

S. Mark Spearing, Martin A. Schmidt, Christine H. Tsau, 1999 .

Fabrication of wafer-level thermocompression bonds

S. M. Spearing, Christine H. Tsau, S. Spearing, 2002 .