Hai Lan

发表

An Environmentally-Friendly Tourist Village in Egypt Based on a Hybrid Renewable Energy System––Part One: What Is the Optimum City?

Lijun Zhang, Fahd Diab, Salwa Ali, 2015 .

Analysis of power integrity and its jitter impact in a 4.3Gbps low-power memory interface

Jihong Ren, Hai Lan, Xinhai Jiang, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Modeling and measurement of supply noise induced jitter in a 12.8Gbps single-ended memory interface

Hai Lan, R. Schmitt, Minghui Han, 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

DPM dispersion inside a single straight entry using dynamic mesh model

Ying Li, Yi Zheng, Hai Lan, 2017, International journal of coal science & technology.

Vertical hall sensor of high sensitivity and excellent confinement fabricated on the (110) silicon substrate

Hai Lan, Hong-Wei Chiu, Sheyshi Lu, 2001, Microelectronic and MEMS Technologies.

Simultaneous switching noise modelling and characterization in production environments

Hai Lan, John Yan, Yuri Tretiakov, 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI).

In-situ characterization of 3D package systems with on-chip measurements

Dan Oh, Ling Yang, Hai Lan, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Analysis and Measurement of Power Integrity and Jitter Impacts on Thin-Core and Coreless Packages

Hai Lan, Ming Li, Yeon-Chang Hahm, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Modeling and analysis of supply noise timing impact in a DDR4 interface system

Ravi Kollipara, Hai Lan, Joohee Kim, 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems.

Investigating the Impact of Supply Noise on the Jitter in Gigabit I/O Interfaces

Chuck Yuan, Hai Lan, R. Schmitt, 2007, 2007 IEEE Electrical Performance of Electronic Packaging.

Power integrity characterization and correlation of 3D package systems using on-chip measurements

Dan Oh, Joong-Ho Kim, Ling Yang, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

Characterization of a low-power 6.4 Gbps DDR DIMM memory interface system

Yi Lu, Lei Luo, Michael Bucher, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Power integrity of a 4.8Gbps-per-link low-swing single-ended-I/O server memory interface

Jihong Ren, Ravi Kollipara, Hai Lan, 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.

An Environmentally-Friendly Tourist Village in Egypt Based on a Hybrid Renewable Energy System––Part Two: A Net Zero Energy Tourist Village

Lijun Zhang, Fahd Diab, Salwa Ali, 2015 .

Return loss characterization and analysis of high-speed serial interface

Hai Lan, Chris Madden, Wendemagegnehu T. Beyene, 2015, 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS).

Power flow calculation method of large shipboard power system

Hai Lan, Dian-hua Zhang, Jiu-fang Li, 2010 .

Simulation and Measurement of On-Chip Supply Noise in Multi-Gigabit I/O Interfaces

Chuck Yuan, Hai Lan, R. Schmitt, 2008, ISQED 2008.

On-chip measurement and characterization for high-speed links

Hai Lan, Chris Madden, 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.

Investigating substrate coupling noise impact on low-power memory controller PHY interface using on-chip measurement structure

Chuck Yuan, Nhat Nguyen, Hai Lan, 2010, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.

Statistical link analysis and in-situ characterization of high-speed memory bus in 3D package systems

Jihong Ren, Dan Oh, Ling Yang, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Design of push–pull system to control diesel particular matter inside a dead-end entry

Yi Zheng, Hai Lan, Magesh Thiruvengadam, 2015, International journal of coal science & technology.

An environmentally friendly factory in Egypt based on hybrid photovoltaic/wind/diesel/battery system

Lijun Zhang, Fahd Diab, Salwa Ali, 2016 .

Signal and power integrity analysis of a 256-GB/s double-sided IC package with a memory controller and 3D stacked DRAM

Scott Best, Hai Lan, Ming Li, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate

Hai Lan, A. Weisshaar, A. Weisshaar, 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).

Signal and Power Integrity for a 1600 Mbps DDR3 PHY in Wirebond Package

June Feng, Hai Lan, Ralf Schmitt, 2011 .

Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate

Hai Lan, Andreas Weisshaar, A. Weisshaar, 2001, IMS 2001.