Wenguo Ning

Void control during plating process and thermal annealing of through-mask electroplated copper interconnects

Heng Li, Chunsheng Zhu, Le Luo, 2014, Microelectron. Reliab..

Stress evolution during thermal cycling of copper/polyimide layered structures

Le Luo, Gaowei Xu, Chunsheng Zhu, 2014 .

Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

Le Luo, Wenguo Ning, L. Luo, 2009, IEEE Transactions on Electronics Packaging Manufacturing.

Influence of the Viscoelastic Properties of the Polyimide Dielectric Coating on the Wafer Warpage

Le Luo, Gaowei Xu, Chunsheng Zhu, 2014, Journal of Electronic Materials.

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Le Luo, Xiaowei Sun, Huajiang Wang, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

FEA study of the evolution of wafer warpage during reflow process in WLP

Le Luo, Gaowei Xu, Chunsheng Zhu, 2012 .