Shang-Shiuan Deng

Thermal simulation of System in Package (SiP) in soak zone of reflow process

Sheng-Jye Hwang, Huei-Huang Lee, Shang-Shiuan Deng, 2014, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

Sheng-Jye Hwang, Huei-Huang Lee, Shang-Shiuan Deng, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.