P. Wesling

Electronics packaging education: NSF and IEEE initiatives and modules

P. Wesling, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

TAB inner-lead bond process characterization for single-point laser bonding

P. Wesling, A. Emamjomeh, 1994 .

Standards-based multimedia education for electronics packaging

P. Wesling, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Models for internet-delivered courses in electronics packaging

P. Wesling, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Multimedia education: training for packaging engineers

P. Wesling, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

CMOS multichip module test vehicle with TAB'd components

P. Wesling, J. Shiao, T. Chung, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.