Navas Khan

Design and development of a multi-die embedded micro wafer level package

A. Kumar, V. Kripesh, Zhang Xiaowu, 2008, 2008 58th Electronic Components and Technology Conference.

Design and fabrication of a reliability test chip for 3D-TSV

Li Hong Yu, C. T. Chong, Chai Tai Chong, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

John H. Lau, Nandar Su, Vaidyanathan Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.

Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package

John H. Lau, Seung Wook Yoon, Aibin Yu, 2008, ECTC 2008.

Development of 3D silicon module with TSV for system in packaging

V. Lee, Ho Soon We, Navas Khan, 2008, 2008 58th Electronic Components and Technology Conference.

Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device

Ying Ying Lim, V. Kripesh, Andy Fenner, 2010, 2010 12th Electronics Packaging Technology Conference.